Hv3 Flux

Basic Info.

Model NO.	HV3
Max. Cool Down Ramp	60-120/Minute
Cooling Way	Nitrogen/Water-Cooled (Shell, Heating Plate)
Max. Heat up Ramp	120c/Minute
Voltage	220V 25-60A
Weight	360kg
Control Deviation	+/- 1°c
Heating Plate	Sic Coated Graphite
Max Temperature	500 C
Heating Elements	Infrared Heating Lamps
Maximum Vacuum	1X10-6bar
Soldering Area	260*240mm
Chamber Height	>=100mm
Process Environment	Nitrogen, Formic Acid
Transport Package	Polywood Case and Foam
Specification	950*1200*1100mm
Trademark	TORCH
Origin	Beijing, China
HS Code	8514101000
Production Capacity	100 Set/Year

Product Description

HV3 Flux-Free Nitrogen Metal cap sealing Vacuum Reflow Soldering and Brazing oven
Model: HV3Application:
IGBT/DBC
Power Semiconductors
Sensors
MEMS Devices
DIE Attachment
High Power LED
Hybrid Assembly
Flip Chip
Package Sealing
Feature of the vacuum reflow oven:1. Soldering temperature: the maximum soldering temperature of HV3 vacuum eutectic furnace is ≥ 500 ºC. 2. Vacuum degree: limit vacuum degree ≤ 10-6 PA working vacuum: 10-4 PA. 3. Effective welding area: ≥ 260mm * 240mm 4. Furnace height: ≥ 100mm, customized for special height. 5. Heating method: infrared heating at the bottom + infrared heating at the top. The heating plate adopts semiconductor silicon carbide graphite platform. It is not easy to deform after long-time use, and has high thermal conductivity, making the surface temperature of the heating plate more uniform. 6. Temperature uniformity: within the effective soldering area ≤± 2%. 7. Heating ramp:120 ºC / minute. 8.Cooling ramp: 60-120 ºC / minute (the ramp of no-load, temperature cooling from 100 ºC).9. Meet the soldering requirements of soldering materials temperature≤ 500 ºC. For example: In97Ag3, In52Sn48, Au80Sn20, SAC305, Sn90Sb10, Sn63Pb37, Sn62Pb36Ag2 and other preforms (can be soldered without flux eutectic), solder paste of various components, and curing of materials below 500 degrees.10. Soldering void rate: After a large number of customer verification, when HV3 vacuum eutectic furnace solder with soft solder, the void rate can be controlled between 0-3%.

Vacuum furnace Technical parameter:

Model	HV3
Soldering Size	260*240mm
Furnace height	100mm(other Hights is optional)
Maximum Temperature	500ºC
vacuum	≤3Pa with mechanical pump,≤10-4Pa with molecular pump
Heat up ramp	120 ºC / minute
Cool down ramp	60-120 ºC / minute
Voltage	220V, 25-60A
Rated Power	18KW
Weight	360kg
Dimension	600*600*1300mm
Wight	250KG
The maximum heating rate	120ºC/min
The maximum cooling rate	Only water-cooled 60ºC/min, Air-cooled + water-cooled 120ºC/min
Cooling Way	Air-cooled / water-cooled (shell, heating plate)

Soldering result:

Company information: